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Precision Lamination Equipment - List of Manufacturers, Suppliers, Companies and Products

Precision Lamination Equipment Product List

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Precision Bonding Device (Semi-Automatic)

Precision Bonding Device (Semi-Automatic)

Precision Bonding Device (Semi-Automatic)

This device is used for manually positioning and bonding two substrates, such as glass substrates and optical film substrates. In recent years, the demand for thinner bonded products and higher levels of appearance accuracy has increased. However, we have consolidated our bonding technology (speed and pressure control mechanisms) into a space-saving device, achieving high-quality bonding without scratches or bubbles.

  • Other processing machines
  • Other physicochemical equipment
  • Other semiconductor manufacturing equipment

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Precision fitting, stress-free adhesion

Precision fitting, stress-free adhesion

Stress-free! It suppresses shape changes and makes the most of the excellent properties of the material.

Stress-free lamination suppresses changes in the shape of materials, utilizing their characteristics and functions. When the processing accuracy during lamination is low, the shape of the material changes, affecting quality. Fuji Premium suppresses subtle shape changes caused by lamination without applying stress. This is a technology unique to Fuji Premium, which has accumulated extensive knowledge about the characteristics of materials. 【Features】 - Suppresses changes in material shape - Utilizes characteristics and functions - Does not apply stress - Precisely laminates along the pixel lines - Does not compromise material characteristics For more details, please contact us or download the catalog.

  • Other processing machines

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